ALPHA?OM-338-T 是一款無(wú)鉛免清洗錫膏，設(shè)計(jì)用于多種應(yīng)用。ALPHA OM-338-T 較寬的加工窗口設(shè)計(jì)用于最大程度減少?gòu)腻a/鉛到無(wú)鉛錫膏的過(guò)渡問(wèn)題。這種材料被設(shè)計(jì)為具有與錫鉛工藝相媲美的性能。*ALPHA OM-338-T 在多種電路板設(shè)計(jì)上都能產(chǎn)生出色的印刷能力性能，尤其是在具有超精細(xì)特征重復(fù)性（11 平方密爾）和高吞吐量的應(yīng)用中。
出色的回流工藝窗口提供了良好的 CuOSP 焊接性，能夠出色地熔融愈合多種沉積尺寸，具有出色的抗隨機(jī)錫珠形成性以及片式元件間錫珠性能。ALPHA OM-338-T 采用的配方可產(chǎn)生出色的焊點(diǎn)外觀。此外，ALPHA OM-338-T 的 IPC III 類空洞和 ROL0 IPC 分類能力確保了最大程度提高長(zhǎng)期產(chǎn)品可靠性。ALPHA OM-338-T 也被稱為具有 M13 粘度的 ALPHA OM-338。
特點(diǎn)和優(yōu)勢(shì)
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
- Excellent print consistency with high process capability index across all board designs.
- Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
- Wide reflow profile window with good solderability on various board / component finishes.
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- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III.
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
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